Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR
Manufacturing Electronic Assemblies from Prototype to Pre-Series Production
The PCB assembly line at Fraunhofer FHR provides a modern manufacturing environment for the development and production of electronic assemblies. It supports projects ranging from initial functional models and demonstrators to prototype manufacturing and pre-series production. By combining high-precision PCB assembly, advanced soldering processes, and comprehensive quality control, the facility provides a seamless manufacturing process.
Particularly for radar, sensor, and high-frequency systems, the infrastructure enables the rapid implementation of new developments and supports the transition from research to industrial applications. The close integration of development and manufacturing allows assemblies to be tested and optimized at an early stage and prepared for subsequent series production.
High-Precision PCB Assembly for Demanding Electronic Systems
The production line combines automated stencil printing, high-precision component placement, and vapor-phase soldering. With a placement accuracy of up to ±30 micrometers, even highly integrated circuits and complex high-frequency assemblies can be manufactured reliably. The range of components that can be processed extends from 01005 chip components to components measuring up to 80 × 33 millimeters. PCB formats ranging from 50 × 50 millimeters to 460 × 380 millimeters enable the production of a wide variety of electronic systems. Additional jet dispensing processes allow solder paste and adhesives to be applied with high precision.
Rework for Prototypes and Complex Assemblies
In addition to PCB assembly, advanced rework processes are available. IR rework technology enables QFP, QFN, and BGA components to be precisely replaced or reworked. The high placement accuracy allows even complex assemblies to be reliably modified at later stages of development. This helps shorten development cycles and enables cost-effective modifications without the need to manufacture complete assemblies from scratch.
Wire Bonding for High-Frequency and Microwave Applications
For high-frequency and microwave applications, Fraunhofer FHR offers professional wire bonding processes. Gold ribbons and gold wires enable the precise interconnection of sensitive chips, MMICs, and other semiconductor components. Wire bonding provides an essential foundation for high-performance radar, sensor, and millimeter-wave systems and enables the production of modules optimized for high-frequency applications with minimal signal losses and high reliability.
Quality Assurance Using AOI, X-Ray Inspection, and Computed Tomography
Reliable electronics manufacturing requires equally precise quality control. The PCB assembly line therefore features automated optical inspection (AOI) processes for inspecting component placement, solder joints, and PCB structures designed for high-frequency applications. In addition, X-ray inspection and computed tomography enable the non-destructive analysis of concealed solder joints and internal structures of electronic assemblies. This allows defects to be identified at an early stage and manufacturing quality to be verified in detail.
Manufacturing Expertise for Radar, Sensor, and High-Frequency Systems
The PCB assembly line is used in numerous Fraunhofer FHR development projects and supports the production of electronic assemblies across different technology readiness levels. It facilitates rapid prototype development, supports further development through to pre-series production, and contributes to subsequent industrialization by enabling the transfer of production to manufacturing service providers. Quality assurance in accordance with ISO 9001 and established IPC standards provides the basis for reproducible and reliable manufacturing processes.