High‑Frequency Technologies

DieThe manufacturing infrastructure for electromagnetic applications enables the rapid and precise production of complex components for radar and sensor systems. Polymer-based laser sintering processes produce robust structures from polyamide as well as electromagnetically optimized components made of polypropylene. Metal-based laser melting techniques allow the fabrication of highly complex waveguides, heat sinks, and other components. In addition, large-format polymer printing systems based on fused filament fabrication are available, offering material flexibility and the capability to process composite filaments. Resin-based stereolithography enables the production of optical elements with high surface quality, while a high-precision CNC milling machine achieves fine mechanical details. Post-processing technologies such as metallization, vibratory finishing, and micro-blasting ensure the required surface quality and electromagnetic performance.

Use Case Example

• VALESTRA

The on-wafer measurement capabilities at Fraunhofer FHR’s Bochum site support companies and research teams in reliably validating integrated RF circuits—from initial designs through to final optimization. The joint laboratory with Ruhr University Bochum provides comprehensive capabilities for the characterization of individual chips as well as for material analysis. The measurement setup offers various configurations for vector network analysis, seamlessly covering a frequency range from 900 Hz up to 500 GHz. Signal and spectrum analysis, as well as reliable calorimetric power measurements, are available for frequencies of up to 325 GHz. In addition, multiple methods are provided for characterizing the noise performance of RF circuits. All measurements can be conducted under temperature-controlled conditions ranging from –40 °C to 125 °C. The platform is a key component of chip development at Fraunhofer FHR and is utilized in a wide range of projects. 

Use Case Example

• APECS

The Fraunhofer FHR assembly line is a state-of-the-art manufacturing environment for precise PCB assembly, covering everything from functional prototypes to pre-series production. It combines automated stencil printing, high-accuracy component placement with tolerances of up to ±30 µm, and flexible soldering processes such as vapor phase soldering.

A wide component spectrum, ranging from 01005 chip components to large-format structures, enables the realization of complex high-frequency systems. The line is complemented by rework, bonding, and inspection processes, including automated optical inspection (AOI) for visual verification of component placement and solder joints, as well as X-ray and computed tomography (CT) methods for non-destructive analysis of internal structures. These capabilities ensure reliable and comprehensive quality control down to the finest level of detail.

Use Case Example

• ERW/RABO oder GESTRA oder ADRAS LINK!!!!

The precision engineering facility at Fraunhofer FHR serves as a key interface between development and the practical realization of highly complex radar systems. It enables the fabrication of high-precision individual components and prototypes—from small subassemblies to complete enclosures. State-of-the-art five-axis CNC machining centers achieve surface qualities in the sub-micrometer range and support the production of advanced high-frequency components up to the terahertz range. The capabilities are complemented by expertise in waveguide technology as well as surface finishing processes such as gold and nickel plating. Through the combination of extensive experience, advanced manufacturing processes, and a high degree of flexibility, the workshop makes a significant contribution to the development, optimization, and industrialization of innovative sensor systems.. 

Further Information

• Precision Engineering Facility

µRadas is a highly integrated radar sensing system that combines precision measurement technology, compact design, and a flexible system architecture. The microcontroller-based sensor processes signals directly on board, enabling highly accurate distance measurements at very high sampling rates in real time. Thanks to its modular design, µRadas can be adapted to a wide range of requirements and operated within synchronized sensor networks. Its advanced front-end technology, featuring high bandwidth, supports not only precise distance sensing but also detailed 2D and 3D imaging. This allows both surface features and internal structures to be captured contactlessly and visualized as informative point clouds. Owing to its compact form factor and high level of integration, µRadas is particularly well suited for demanding measurement tasks in confined spaces, opening up new possibilities for precise, non-destructive analysis.

he PCB milling machine at Fraunhofer FHR is based on a milling and drilling plotter and enables the rapid, high-precision fabrication of double-layer FR4 circuit boards for prototyping and experimental RF circuits. The system offers a working area of 400 × 500 mm with a Z-axis travel of 64 mm and operates with high-resolution CNC mechanics that reliably produce fine structures and precise drill holes. It supports the development of complex radar and high-frequency modules, shortens iteration cycles, and facilitates close integration of design, manufacturing, and testing within Fraunhofer FHR’s RF technology and manufacturing platform.

Fraunhofer FHR offers a comprehensive range of services for the development of radar sensors based on analog and digital circuit assemblies. We design custom sensor and PCB solutions, create schematics, and implement professional PCB layouts—from multilayer boards to complex HDI, flex, and rigid-flex designs. Our sensor designs are consistently optimized for electromagnetic compatibility (EMC) and ensure high signal and power integrity, enabling reliable and robust system operation.

Our in-house layout and routing services enable short coordination cycles, rapid iterations, and efficient prototyping through to small-series production. Typical application areas range from industrial electronics and safety-critical systems to embedded systems and prototype development.