The demands placed on next-generation electronic systems are continuously increasing: higher operating frequencies, growing integration densities, and emerging applications in communication, sensing, and automation require novel approaches to the design and manufacturing of microelectronic systems. To address these challenges, the European pilot line APECS is being established as a pan-European innovation platform for advanced packaging and heterogeneous integration. Its objective is to accelerate the transition of research outcomes into industrial applications while strengthening Europe’s technological sovereignty.
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