Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR
The demands placed on next-generation electronic systems are continuously increasing: higher operating frequencies, growing integration densities, and emerging applications in communication, sensing, and automation require novel approaches to the design and manufacturing of microelectronic systems. To address these challenges, the European pilot line APECS is being established as a pan-European innovation platform for advanced packaging and heterogeneous integration. Its objective is to accelerate the transition of research outcomes into industrial applications while strengthening Europe’s technological sovereignty.
European Pilot Line for Heterogeneous Integration
APECS establishes an open infrastructure for the development and pilot-scale manufacturing of next-generation electronic systems. The focus lies on chiplet technologies, heterogeneous integration, and the System Technology Co-Optimization (STCO) approach, in which system design and manufacturing processes are jointly optimized. The objective is to accelerate the transfer of high-performance and trustworthy systems into industrial applications.
The pilot line specifically addresses small and medium-sized enterprises (SMEs), start-ups, and industrial end users, enabling them to benefit from advanced manufacturing processes, standardized integration platforms, and shortened development cycles. APECS strengthens European supply chains and supports the expansion of a resilient and future-proof microelectronics manufacturing ecosystem.
Contribution of Fraunhofer FHR: High-Frequency Excellence for Next-Generation Electronic Systems
Fraunhofer FHR contributes its expertise in high-frequency engineering, radar, and microwave systems to the pilot line. Core activities include the development and characterization of high-frequency microwave and millimeter-wave integrated circuits (MMICs), integrated antenna architectures, and components operating up to the terahertz range (0.1–1.1 THz).
In addition to circuit design, Fraunhofer FHR is responsible for the development and validation of interfaces and modules for the efficient coupling of heterogeneous semiconductor technologies. To this end, 3D electromagnetic simulation methods are employed to precisely model antennas, transitions, and interconnect structures and to integrate them into next-generation design kits. Furthermore, FHR provides calibration concepts and measurement methodologies that enable reliable characterization at the highest frequency ranges. This work supports the seamless integration of radar sensing, high-frequency communication, and heterogeneous system technologies across the entire value chain.
Novel RF Design Methodologies: Key Technologies for Scalable Integration Platforms
Significant advances have been achieved in the modeling and characterization of high-frequency transitions between chip, glass interposer, and package. Newly developed stack-up models, calibration and de-embedding structures, as well as physically interpretable equivalent circuit models enable precise analysis of complex interfaces. These methodologies form the foundation for scalable integration concepts and next-generation packaging solutions.
Fraunhofer FHR D-Band Demonstrator
A key project outcome is a heterogeneously integrated radar demonstrator operating in the 120–150 GHz range. The module combines a SiGe BiCMOS radar chiplet with an RF glass interposer and integrated antennas. Flexible polymer substrates enable novel applications, such as the deployment of synchronized radar modules on curved surfaces for future 6G communication and sensing systems.
Calibration and test structures allow precise characterization of interconnects and transitions, providing essential data for the development of future industry-standard design kits.
Strong European Alliance and Strategic Funding
APECS is coordinated by the Fraunhofer-Gesellschaft and implemented within the framework of the Research Fab Microelectronics Germany (FMD). Numerous European research organizations are involved in the initiative. Funding is provided by the EU Chips Joint Undertaking as well as national funding bodies. The state of North Rhine-Westphalia (NRW) supports the project through ERDF (European Regional Development Fund) resources. The total funding volume amounts to €2,469,937.46.
