NGK, known for ceramic materials, has developed a novel process that combines silicon with quartz glass. This material innovation allows for lower losses and higher energy efficiency compared to conventional silicon-based solutions, making it a sustainable approach for future communication and radar systems.

In the first phase of the cooperation, Fraunhofer IZM investigated the wafer bonding technology developed by NGK with regard to the development of innovative, particularly broadband sub-THz antennas. These were fabricated directly on wafers, separated, and optimized for use in 6G wireless systems. "By combining quartz glass and silicon in an optimized wafer bonding process, highly-efficient broadband antennas and frontend modules for future 6G networks and sub-THz radar systems can be developed," explains Prof. Dr. Ivan Ndip from Fraunhofer IZM.

Building on the success of this first phase, NGK has initiated a second phase of collaboration with Fraunhofer IZM and Fraunhofer FHR. The goal is to develop a high-resolution D-band sub-THz radar system using NGK's quartz glass-bonded wafer technology, particularly suitable for applications inside vehicles (In-Cabin Sensing). In this second phase, a radar MMIC chip developed by Fraunhofer FHR will be integrated together with a broadband antenna array designed by Fraunhofer IZM and fabricated by NGK to develop a sub-THz radar front end module. This module will then be used to build and test a radar system demonstrator.

NGK emphasizes, "Collaboration with Fraunhofer IZM and Fraunhofer FHR has allowed us to explore and further develop our material technology for entirely new application fields." A joint patent has been filed to advance the technology and enable next generation high-frequency solutions for 6G and radar.